High-performance X-ray testing equipment, can be applied to the PCBA, BGA, CSP, Flip Chip, the detection and other internal perspective detection? The processing defect detection assembly open circuit, short circuit, over welding, cold welding, dislocation.? Tube voltage up to 130KV, 130 million pixel image processing, image is clear.? 3D detection (rotating 360 ° tilt 60 °)? automatic positioning function, automatic area measurement function.? handle control, easy to use high security (X- RAY leaked the following less than 1μSv / h).